Delaunay-Voronoi modeling of power-ground planes with source port correction

IEEE Transactions on Advanced Packaging

Volumn 31, Issue 2, 2008, Pages 303-310

  Wu, Kai Bin ^a   Shiue, Guang Hwa ^b   Guo, Wei Da ^a   Lin, Chien Min ^c   Wu, Ruey Beei ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b LUNGHWA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^c TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Delaunay triangular mesh; Plane impedance; Power distribution network; SPICE compatible model; Via effect; Virtual port; Voronoi tessellation

Indexed keywords

CAPACITORS; COMPUTER SIMULATION; ELECTRIC POWER DISTRIBUTION; MATHEMATICAL MODELS; MAXWELL EQUATIONS; SPICE;

DELAUNAY-VORONOI MODELING; HANKEL FUNCTION; VORONOI TESSELLATION;

ELECTRIC POWER SYSTEMS;

EID: 44449148385     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2008.920326     Document Type: Article

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