Thermal effects in plasma treatment of patterned PDMS for bonding stacked channels

Materials Research Society Symposium - Proceedings

Volumn 782, Issue , 2003, Pages 125-130

  Zou, Jin ^a   Wong, Peter Y ^a  

^a Tufts University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL BONDS; CMOS INTEGRATED CIRCUITS; EUTECTICS; HYDROPHILICITY; MICROELECTROMECHANICAL DEVICES; OXIDATION; SURFACE ROUGHNESS; THERMAL EFFECTS;

ANODIC BONDING; EUTECTIC STATES; PLASMA OXIDATION; PLASMA TREATMENT;

ORGANIC COMPOUNDS;

EID: 2942657677     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-782-a5.5     Document Type: Conference Paper

References (7)

1. M. Schmidt "Wafer-to-wafer Bonding for Microstructure Formation" Proceeding of The IEEE, vol. 86, No.8 August 1998
2. T. Abe and T. Itoh, "Silicon wafer bonding process technology for SOI structure", Proc. 4th Int. Symp. Silicon-on-Insulator Technology and Devices, 1990 P.61
3. Y.T.cheng, Liwei Lin "Localized Silicon Fusion and Eutectic Bonding for MEMS Fabrication and packaging" J. of MEMS, vol.9 No.1, March 2000
4. J.Zou and C.H. Mastrangelo "Component failure analysis in MEMS packaging" Proceeding of IMECE2002-39263, ASME, December 2002
5. Frank Nikiaus "Low temperature wafer-level Transfer Bonding" J. of MEMS, Vol. 10 No.4 December 2001
6. C.H. Mastrangelo "Adhesion-related failure mechanisms in micromechanical device" Tribology Letters, 1997
7. W. Maszara and A.J.R. de Kock, "Role of surface morphology in wafer bonding" J. Appl. Phys., Vol. 69, No.1, p.257, Jan. 1991