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Journal of Electronic Materials

Volumn 39, Issue 11, 2010, Pages 2387-2396

Influence of palladium thickness on the soldering reactions between Sn-3Ag-0.5Cu and Au/Pd(P)/Ni(P) surface finish

(4) Wu, W H a Lin, C S a Huang, S H a Ho, C E a

a YUAN ZE UNIVERSITY (Taiwan)

Author keywords

Au Pd(P) Ni(P); Interfacial reaction; Ni 2SnP; Pd(P) thickness; Shear test; Sn Ag Cu

Indexed keywords

AU/PD(P)/NI(P); INTERFACIAL REACTIONS; NI 2SNP; PD(P) THICKNESS; SHEAR TESTS; SN-AG-CU;

FLIP CHIP DEVICES; INTERMETALLICS; OVENS; PALLADIUM; SILVER; SILVER ALLOYS; SOLDERING; TIN ALLOYS;

TIN;

EID: 78149281125 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1351-9 Document Type: Article

Times cited : (67)

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