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Volumn 46, Issue 11, 2005, Pages 2386-2393
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Interfacial reaction and mechanical characterization of eutectic Sn-Zn/ ENIG solder joints during reflow and aging
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Author keywords
Ball shear test; Electroless nickel immersion gold; Interfacial reaction; Lead free solder; Tin zinc solder
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Indexed keywords
AGING OF MATERIALS;
ELECTROLESS PLATING;
EUTECTICS;
GOLD;
INTERMETALLICS;
NICKEL;
TIN ALLOYS;
BALL SHEAR TEST;
ELECTROLESS NICKEL-IMMERSION GOLD;
INTERFACIAL REACTION;
LEAD-FREE SOLDER;
TIN-ZINC SOLDER;
SOLDERED JOINTS;
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EID: 30844470239
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.46.2386 Document Type: Article |
Times cited : (10)
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References (25)
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