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Volumn 46, Issue 11, 2005, Pages 2386-2393

Interfacial reaction and mechanical characterization of eutectic Sn-Zn/ ENIG solder joints during reflow and aging

Author keywords

Ball shear test; Electroless nickel immersion gold; Interfacial reaction; Lead free solder; Tin zinc solder

Indexed keywords

AGING OF MATERIALS; ELECTROLESS PLATING; EUTECTICS; GOLD; INTERMETALLICS; NICKEL; TIN ALLOYS;

EID: 30844470239     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2386     Document Type: Article
Times cited : (10)

References (25)
  • 13
    • 30844440454 scopus 로고    scopus 로고
    • Website: www.nemi.org


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.