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Volumn 21, Issue 1, 2003, Pages 116-125

The effect of additional elements on the interfacial structure and strength at the solder joint between Sn-Ag-X solder and electroless Ni-P Planting

Author keywords

Electroless Ni P film; Joint strength; Lead free solder; P rich layer; Reaction layer; Zn addition

Indexed keywords

ANNEALING; ELECTROLESS PLATING; INTERFACES (MATERIALS); NICKEL ALLOYS; SOLDERING ALLOYS; STRENGTH OF MATERIALS; THICKNESS MEASUREMENT;

EID: 4344681538     PISSN: 02884771     EISSN: None     Source Type: Journal    
DOI: 10.2207/qjjws.21.116     Document Type: Article
Times cited : (5)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.