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Volumn 46, Issue 11, 2005, Pages 2380-2385

Joints soldered on electroless Ni-Au surfaces using Cu-containing flux: Strength, microstructure and mechanism of improvement

Author keywords

Electroless nickel phosphorus; Flux; Joint strength; Lead free solder; Phosphorus rich layer

Indexed keywords

ELECTROLESS NICKEL-PHOSPHORUS; FLUX; JOINT STRENGTH; LEAD-FREE SOLDER; PHOSPHORUS-RICH LAYER;

EID: 30844463021     PISSN: 13459678     EISSN: None     Source Type: Journal    
DOI: 10.2320/matertrans.46.2380     Document Type: Article
Times cited : (4)

References (10)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.