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Volumn 46, Issue 11, 2005, Pages 2380-2385
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Joints soldered on electroless Ni-Au surfaces using Cu-containing flux: Strength, microstructure and mechanism of improvement
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Author keywords
Electroless nickel phosphorus; Flux; Joint strength; Lead free solder; Phosphorus rich layer
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Indexed keywords
ELECTROLESS NICKEL-PHOSPHORUS;
FLUX;
JOINT STRENGTH;
LEAD-FREE SOLDER;
PHOSPHORUS-RICH LAYER;
COPPER;
DIFFUSION;
ELECTROLESS PLATING;
INTERMETALLICS;
MICROSTRUCTURE;
NICKEL;
SOLDERED JOINTS;
SOLDERING;
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EID: 30844463021
PISSN: 13459678
EISSN: None
Source Type: Journal
DOI: 10.2320/matertrans.46.2380 Document Type: Article |
Times cited : (4)
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References (10)
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