-
1
-
-
0343209109
-
-
ASME New York, NY
-
Z. Mei, P. Gallery, D. Fisher, F. Hua, J. Glazer, Advances in Electronic Packaging-1997 (New York, NY: ASME 1997) 1543-1550
-
(1997)
Advances in Electronic Packaging-1997
, pp. 1543-1550
-
-
Mei, Z.1
Gallery, P.2
Fisher, D.3
Hua, F.4
Glazer, J.5
-
2
-
-
42449132346
-
-
Japan Institute of Electronics Packaging Osaka
-
S. Sakatani, Y. Kohara, T. Saeki, K. Uenishi, K.F. Kobayashi, 12th Symposium on Microelectronics, (Osaka: Japan Institute of Electronics Packaging, 2002) 127-130
-
(2002)
12th Symposium on Microelectronics
, pp. 127-130
-
-
Sakatani, S.1
Kohara, Y.2
Saeki, T.3
Uenishi, K.4
Kobayashi, K.F.5
-
3
-
-
42449131095
-
-
Japan Institute of Electronics Packaging Osaka
-
T. Hiramori, M. Ito, M. Yoshikawa, A. Hirose, K.F. Kobayashi, 12th Symposium on Microelectronics, (Osaka: Japan Institute of Electronics Packaging, 2002) 131-134
-
(2002)
12th Symposium on Microelectronics
, pp. 131-134
-
-
Hiramori, T.1
Ito, M.2
Yoshikawa, M.3
Hirose, A.4
Kobayashi, K.F.5
-
4
-
-
0036698810
-
-
Y. Chonan, T. Komiyama, J. Onuki, R. Uraao, T. Kimura, T. Nagano, Mater. Trans. 43, 1840 (2002)
-
(2002)
Mater. Trans.
, vol.43
, pp. 1840
-
-
Chonan, Y.1
Komiyama, T.2
Onuki, J.3
Uraao, R.4
Kimura, T.5
Nagano, T.6
-
5
-
-
0036872076
-
-
N. Torazawa, S. Arai, Y. Takase, K. Sasaki, H. Saka, J. Jpn. Inst. Met. 66, 1122 (2002)
-
(2002)
J. Jpn. Inst. Met.
, vol.66
, pp. 1122
-
-
Torazawa, N.1
Arai, S.2
Takase, Y.3
Sasaki, K.4
Saka, H.5
-
6
-
-
0242721258
-
-
C.W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, J. Mater. Res. 18, 2540 (2003)
-
(2003)
J. Mater. Res.
, vol.18
, pp. 2540
-
-
Hwang, C.W.1
Suganuma, K.2
Kiso, M.3
Hashimoto, S.4
-
7
-
-
7044228178
-
-
C.W. Hwang, K. Suganuma, M. Kiso, S. Hashimoto, J. Electron. Mater. 33, 1200 (2004)
-
(2004)
J.Electron. Mater.
, vol.33
, pp. 1200
-
-
Hwang, C.W.1
Suganuma, K.2
Kiso, M.3
Hashimoto, S.4
-
9
-
-
1542486338
-
-
T. Hiramori, M. Ito, M. Yoshikawa, A. Hirose, K.F. Kobayashi, J. Jpn. Inst. Electron. Packaging. 6, 503 (2003)
-
(2003)
J. Jpn. Inst. Electron. Packag.
, vol.6
, pp. 503
-
-
Hiramori, T.1
Ito, M.2
Yoshikawa, M.3
Hirose, A.4
Kobayashi, K.F.5
-
11
-
-
4344681538
-
-
Y. Nakahara, K. Hira, R. Ninomiya, M. Tagami, M. Sugai, Q. J. Jpn. Weld. Soc. 21, 116 (2003)
-
(2003)
Q. J. Jpn. Weld. Soc.
, vol.21
, pp. 116
-
-
Nakahara, Y.1
Hira, K.2
Ninomiya, R.3
Tagami, M.4
Sugai, M.5
-
12
-
-
30844469428
-
-
Japan Welding Society Yokohama
-
T. Hiramori, M. Ito, Y. Tanii, A. Hirose, K.F. Kobayashi, 10th Symposium on Microjoining and Assembly Technology in Electronics (Yokohama: Japan Welding Society, 2004) 165-170
-
(2004)
10th Symposium on Microjoining and Assembly Technology in Electronics
, pp. 165-170
-
-
Hiramori, T.1
Ito, M.2
Tanii, Y.3
Hirose, A.4
Kobayashi, K.F.5
-
13
-
-
42449090394
-
-
Japan Institute of Electronics Packaging Osaka
-
K. Yamamoto, H. Akahoshi, T. Kurashina, Y. Nozawa, R. Kimoto, 14th Symposium on Microelectronics, (Osaka: Japan Institute of Electronics Packaging, 2004) 77-80
-
(2004)
14th Symposium on Microelectronics
, pp. 77-80
-
-
Yamamoto, K.1
Akahoshi, H.2
Kurashina, T.3
Nozawa, Y.4
Kimoto, R.5
-
14
-
-
42449143603
-
-
Piscataway, NJ: IEEE
-
Y.C. Shon, J. Yu, S.K. Kang, D.Y. Shih, and T.Y. Lee, Proceedings of the 55th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2005), pp. 83-88
-
(2005)
Proceedings of the 55th Electronic Components and Technology Conference
, pp. 83-88
-
-
Shon, Y.C.1
Yu, J.2
Kang, S.K.3
Shih, D.Y.4
Lee, T.Y.5
-
15
-
-
33845562112
-
-
Piscataway, NJ: IEEE
-
Y.D. Jeon, Y.B. Lee, and Y.S. Choi, Proceedings of the 56th Electronic Components and Technology Conference (Piscataway, NJ: IEEE, 2006), pp. 119-124
-
(2006)
Proceedings of the 56th Electronic Components and Technology Conference
, pp. 119-124
-
-
Jeon, Y.D.1
Lee, Y.B.2
Choi, Y.S.3
-
18
-
-
30844463021
-
-
S. Kumamoto, H. Sakurai, K. Ikeda, K. Suganuma, Mater. Trans. 46, 2380 (2005)
-
(2005)
Mater. Trans.
, vol.46
, pp. 2380
-
-
Kumamoto, S.1
Sakurai, H.2
Ikeda, K.3
Suganuma, K.4
-
19
-
-
0034821493
-
-
Lake Buena Vista, FL: IEEE
-
Y.D. Jeon, K.W. Paik, K.S. Bok, W.S. Choi, and C.L. Cho, Proceedings of the 51th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2001), pp. 1326-1332
-
(2001)
Proceedings of the 51th Electronic Components and Technology Conference
, pp. 1326-1332
-
-
Jeon, Y.D.1
Paik, K.W.2
Bok, K.S.3
Choi, W.S.4
Cho, C.L.5
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