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Volumn 37, Issue 6, 2008, Pages 806-814

Joint strength and microstructure for Sn-Ag-(Cu) soldering on an electroless Ni-Au surface finish by using a flux containing a Cu compound

Author keywords

Electroless nickelphosphorus; Flux; Intermetallic compounds; Joint strength; Lead free solder

Indexed keywords

BARRIER FLUX; ELECTROLESS NICKELPHOSPHORUS; JOINT STRENGTH; LEAD-FREE SOLDER;

EID: 42449133709     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0408-5     Document Type: Article
Times cited : (6)

References (19)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.