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Volumn 157, Issue 6, 2010, Pages

Chemical reaction mechanism in the atomic layer deposition of TaC xNy films using tert -Butylimidotris(diethylamido)tantalum

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC HYDROGEN; DEPOSITION BEHAVIOR; DEPOSITION TEMPERATURES; FILM COMPOSITION; FILM-FORMING SPECIES; GAS CELL; GASPHASE; HYDROCARBON SPECIES; IN-SITU; OXIDE SURFACE; QUADRUPOLE MASS SPECTROMETER; REACTION MECHANISM; ROOM TEMPERATURE; SURFACE DECOMPOSITION; SURFACE REACTION MECHANISM;

EID: 77958502152     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3377003     Document Type: Article
Times cited : (9)

References (20)
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    • Song, M.K.1    Rhee, S.-W.2
  • 13
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  • 15
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    • Atomic layer deposition of tungsten using sequential surface chemistry with a sacrificial stripping reaction
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  • 20
    • 33947131864 scopus 로고    scopus 로고
    • High temperature phase transformation of tantalum nitride films deposited by plasma enhanced atomic layer deposition for gate electrode applications
    • DOI 10.1063/1.2643085
    • R. Sreenivasan, T. Sugawara, K. C. Saraswat, and P. C. Mclntyre, Appl. Phys. Lett. APPLAB 0003-6951, 90, 102101 (2007). 10.1063/1.2643085 (Pubitemid 46398421)
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.