Near-field scanning microwave microscope for interline capacitance characterization of nanoelectronics interconnect

IEEE Transactions on Microwave Theory and Techniques

Volumn 57, Issue 1, 2009, Pages 1224-1229

  Talanov, Vladimir V ^a   Schwartz, Andrew R ^b  

^a Solid State Measurements Inc   (United States)

^b U S DEPARTMENT OF ENERGY   (United States)

Author keywords

Interconnect; Interline capacitance; Low dielectric; Lumped element impedance; Near field scanning microwave microscopy

Indexed keywords

INTERCONNECT; INTERLINE CAPACITANCE; LOW- DIELECTRIC; LUMPED-ELEMENT IMPEDANCE; NEAR-FIELD SCANNING;

CAPACITANCE; MICROWAVES; PROBES; SCANNING; TESTING; VEHICLES; WIRE;

THREE DIMENSIONAL;

EID: 77958088164     PISSN: 00189480     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

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