Noncontact electrical metrology of Cu/low-k interconnect for semiconductor production wafers

Applied Physics Letters

Volumn 88, Issue 26, 2006, Pages

  Talanov, Vladimir V ^a   Scherz, André ^a   Schwartz, Andrew R ^a  

^a Neocera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DUAL-DAMASCENE INTERCONNECT; INTERCONNECT MANUFACTURING PROCESSES; METAL PATTERN DENSITY; PATTERNED WAFERS;

COPPER; PERMITTIVITY; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; THIN FILMS;

OPTICAL INTERCONNECTS;

EID: 33745611460     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2216898     Document Type: Article

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