Near-field scanning microwave probe for rapid detection of non-visual and parametric defects in Cu/low-k interconnect on production wafers

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2006, Issue , 2006, Pages 1-5

  Talanov, Vladimir V ^a   Schwartz, Andrew R ^a  

^a Neocera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTRIC VARIABLES MEASUREMENT; FAILURE ANALYSIS; SILICON WAFERS;

DIRECT ELECTRICAL MEASUREMENTS; NEAR-FIELD SCANNED MICROWAVE PROBE (NSMP);

MICROWAVE IRRADIATION;

EID: 33847642064     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. S. M. Anlage, V. V. Talanov, and A. R. Schwartz, in Scanning Probe Microscopy: Electrical and Electromechanical Phenomena at the Nanoscale, edited by S. Kalinin and A. Gruverman (Springer, Berlin, 2006).
2. V. V. Talanov, A. Scherz, R. L. Moreland, and A. R. Schwartz, Appl. Phys. Lett. 88, 134106 (2006).
3. V. V. Talanov, A. Scherz, R. L. Moreland, and A. R. Schwartz, Appl. Phys. Lett. 88, 192906 (2006).
4. S. Satyanarayana, R. McGowan, B. White, and S. Hosali, Semicon. Intl., 28 (6), 63 (2005).