Vertically integrated circuits at Fermilab

IEEE Transactions on Nuclear Science

Volumn 57, Issue 4 PART 2, 2010, Pages 2178-2186

  Deptuch, Grzegorz W ^a   Demarteau, Marcel ^a   Hoff, James R ^a   Lipton, Ronald ^a   Shenai, Alpana ^a   Trimpl, Marcel ^a   Yarema, Raymond ^a   Zimmerman, Tom ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

3D IC technology; CMOS; integrated circuits; pixel detector; radiation imaging detectors; readout electronics; TSV; vertically integrated pixel readout device; wafer bonding

Indexed keywords

CMOS; IC TECHNOLOGY; PIXEL DETECTOR; RADIATION IMAGING DETECTORS; READOUT ELECTRONICS; TSV; VERTICALLY INTEGRATED PIXEL READOUT DEVICE;

CMOS INTEGRATED CIRCUITS; DETECTOR CIRCUITS; HIGH ENERGY PHYSICS; INTEGRATED CIRCUITS; PIXELS; RADIATION DETECTORS; READOUT SYSTEMS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; THREE DIMENSIONAL;

WAFER BONDING;

EID: 77955847861     PISSN: 00189499     EISSN: None     Source Type: Journal    
DOI: 10.1109/TNS.2010.2049659     Document Type: Article

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