Sensor/ROIC integration using oxide bonding

Electronic Proceedings of the International Linear Collider Workshop 2008, LCWS 2008 and ILC 2008

Volumn , Issue , 2008, Pages

  Ye, Zhenyu ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIRECT BOND; MECHANICAL CONNECTIONS; METALLIC INTERLAYER; OXIDE BONDS; READOUT INTEGRATED CIRCUITS; ZIPTRONIX;

SENSORS; SUPERCONDUCTING MATERIALS;

HIGH ENERGY PHYSICS;

EID: 84884663393     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Presentation: http://ilcagenda.linearcollider.org/contributionDisplay.py? contribId=207&sessionId=21&confId=2628.
2. Ziptronix, Inc., 800 Perimeter Park Drive, Suite B, Morrisville, NC 27560; http://www.ziptronix.com/techno/dbi.html
3. IBM Journal of Research and Development Volume 52, No. 6, 2008, Issue devoted to 3D technology.
4. P. Garrou, C. Bower and P. Ramm, Handbook of 3D Integration Technology and Applications of 3D Integrated Circuits, Wiley-VCH, 2008.
5. R. Lipton, et al, contributions to the same conference, arXiv:0901.4741.
6. D. Christian, et al, Nucl. Instr. and Method A549 165 (2005).
7. V. Suntharalingam, et al, Megapixel CMOS Image Sensor Fabricated in Three-dimensional Integrated Circuit Technology, IEEE SSCC 2005, pp356-7.