Characterization of a three-dimensional SOI integrated-circuit technology

Proceedings - IEEE International SOI Conference

Volumn , Issue , 2008, Pages 109-110

  Chen, C K ^a   Checka, N ^a   Tyrrell, B M ^a   Chen, C L ^a   Wyatt, P W ^a   Yost, D R W ^a   Knecht, J M ^a   Kedzierski, J T ^a   Keast, C L ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 57749177710     PISSN: 1078621X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SOI.2008.4656318     Document Type: Conference Paper

References (5)

1. J.A. Burns, et al., IEEE Trans. Electron Devices, vol. 53, p.2507, October 2006.
2. V. Suntharalingam, et al., Proc. Papers IEEE Int. Solid-State Circuits Conf. Tech. Deg., p.356, 2005.
3. B. Aull, et al, Proc. Papers IEEE Int. Solid-State Circuits Conf. Tech. Deg., p.1179, 2006.
4. Q. Gu, et al., Proc. Papers IEEE Int. Solid-State Circuits Conf. Tech. Deg., p.364, 2007.
5. C.K. Chen, et al., Proc. IEEE Int. SOI Conf., p.87, 2007.