3D design activities at Fermilab - Opportunities for physics

Nuclear Instruments and Methods in Physics Research, Section A: Accelerators, Spectrometers, Detectors and Associated Equipment

Volumn 617, Issue 1-3, 2010, Pages 375-377

  Yarema, Raymond ^a   Deptuch, Grezgorz ^a   Hoff, Jim ^a   Shenai, Alpana ^a   Trimpl, Marcel ^a   Zimmerman, Tom ^a   Demarteau, Marcel ^a   Lipton, Ron ^a   Christian, Dave ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

3D integration; Vertical integration

Indexed keywords

ELECTRONICS PACKAGING; HIGH ENERGY PHYSICS;

3-D DESIGNS; 3-D INTEGRATION; 3D CIRCUIT; BONDING TECHNIQUES; BUMP BONDS; FERMILAB; THROUGH SILICON VIAS; VERTICAL INTEGRATION;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 79953792248     PISSN: 01689002     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.nima.2009.09.045     Document Type: Conference Paper

References (3)

1. A. Huffman, Fabrication, assembly, and evaluation of Cu-Cu bump bonding arrays for ultra-fine pitch hybridization and 3d integration, Pixel 2008, Fermilab, Batavia Il, September 2008.
2. R. Yarema, 3D Circuit Integration for vertex and other detectors, in: Proceedings of Science, POS (Vertex 2007) 017.
3. M. Mannelli, CMS tracking trigger straw men, in: CERN ACES Workshop, February 2009.