Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Chen, C L ^a   Yost, D R ^a   Knecht, J M ^a   Chapman, D C ^a   Oakley, D C ^a   Mahoney, L J ^a   Donnelly, J P ^a   Soares, A M ^a   Suntharalingam, V ^a   Berger, R ^a   Bolkhovsky, V ^a   Hu, W ^a   Wheeler, B D ^a   Keast, C L ^a   Shaver, D C ^a  

^a MASSACHUSETTS INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPOUND SEMICONDUCTORS; DIODE ARRAYS; IMAGE ARRAY; INP; INP SUBSTRATES; INP WAFERS; PIXEL SIZE; PROCESSING LINES; READ-OUT CIRCUIT; SILICON-ON-INSULATORS; SOI WAFERS; WAFER-SCALE 3D INTEGRATION;

DIGITAL IMAGE STORAGE; IMAGE SENSORS; READOUT SYSTEMS; SEMICONDUCTING INDIUM; SEMICONDUCTING SILICON; SEMICONDUCTING SILICON COMPOUNDS; SENSOR ARRAYS; THREE DIMENSIONAL; WAFER BONDING;

SILICON WAFERS;

EID: 70549089103     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306556     Document Type: Conference Paper

References (5)

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