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Journal of Materials Science: Materials in Electronics

Volumn 21, Issue 6, 2010, Pages 562-566

Reactive nanolayers for physiologically compatible microsystem packaging

(8) Qiu, Xiaotun a Welch, David a Christen, Jennifer Blain a Zhu, Jie a Oiler, Jon b Yu, Cunjiang a Wang, Ziyu b Yu, Hongyu a,b

a Arizona State University (United States)

b ARIZONA STATE UNIVERSITY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIO-MICROELECTROMECHANICAL SYSTEMS (BIO-MEMS); BIOMEMS; BONDING PROCESS; BONDING TECHNIQUES; BROAD APPLICATION; CELL ENCAPSULATIONS; LOCALIZED HEATING; MICRO FLUIDIC SYSTEM; MICRO-SYSTEM PACKAGING; MOUSE-FIBROBLASTS; NANO FILMS; NANO LAYERS; NUMERICAL MODELS; PARYLENE C; PARYLENES; ROOM TEMPERATURE BONDING; SIMULATION RESULT; TEMPERATURE EVOLUTION; WAFER BONDING TECHNIQUES;

BONDING; CELL CULTURE; COMPOSITE MICROMECHANICS; ELECTRONICS PACKAGING; HEATING; MEMS; MICROELECTROMECHANICAL DEVICES; PACKAGING; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

WAFER BONDING;

EID: 77955570233 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-009-9957-5 Document Type: Article

Times cited : (7)

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