Room-temperature soldering with nanostructured foils

Applied Physics Letters

Volumn 83, Issue 19, 2003, Pages 3987-3989

  Wang, J ^a   Besnoin, E ^a   Duckham, A ^a   Spey, S J ^a   Reiss, M E ^a   Knio, O M ^a   Powers, M ^b   Whitener, M ^b   Weihs, T P ^a  

^a Johns Hopkins University   (United States)

^b AGILENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT SOURCES; INFRARED MEASUREMENTS; REACTIVE FOIL JOINTS;

ALUMINUM FOIL; DIFFERENTIAL SCANNING CALORIMETRY; JOINTS (STRUCTURAL COMPONENTS); MICROSTRUCTURE; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; SOLDERING; STAINLESS STEEL; TENSILE STRENGTH; X RAY DIFFRACTION ANALYSIS;

NANOSTRUCTURED MATERIALS;

EID: 0344945452     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1623943     Document Type: Article

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