Bonding silicon wafers with reactive multilayer foils

Sensors and Actuators, A: Physical

Volumn 141, Issue 2, 2008, Pages 476-481

  Qiu, X ^a   Wang, J ^a,b  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Aluminum; Localized heating; Nickel; Rapid cooling; Reactive multilayer foil; Wafer bonding

Indexed keywords

BOND STRENGTH (MATERIALS); DIFFERENTIAL SCANNING CALORIMETRY; MATHEMATICAL MODELS; MULTILAYERS; X RAY DIFFRACTION;

EXOTHERMIC REACTION; ISOPROPANOL ALCOHOL; LOCAL HEAT SOURCES; LOCALIZED HEATING; REACTIVE MULTILAYER FOILS;

SILICON WAFERS;

EID: 38149090902     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2007.10.039     Document Type: Article

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