Soldering technology for optoelectronic packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1996, Pages 26-36

  Tan, Qing ^a   Lee, Y C ^a  

^a UNIVERSITY OF COLORADO   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; OPTOELECTRONIC DEVICES; RELIABILITY; SOLDERING; SOLDERING ALLOYS; TECHNOLOGY;

FLUXLESS REFLOW; OPTOELECTRONIC PACKAGING; PRECISION ALIGNMENTS; SOLDER ASSEMBLY; SOLDERING TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0029712529     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (73)