Preparation of silica/ceria nano composite abrasive and its CMP behavior on hard disk substrate

Microelectronic Engineering

Volumn 87, Issue 9, 2010, Pages 1747-1750

  Lei, Hong ^a   Chu, Fengling ^a   Xiao, Baoqi ^a   Tu, Xifu ^b   Xu, Hua ^b   Qiu, Haineng ^b  

^a SHANGHAI UNIVERSITY   (China)

^b Shenzhen Kaifa Magnetic Recording Co Ltd   (China)

Author keywords

Chemical mechanical polishing (CMP); Composite abrasive; Hard disk substrate

Indexed keywords

ATOMIC FORCE; CARBAMIDE; COMPOSITE ABRASIVES; HARD DISK SUBSTRATE; HARD SUBSTRATE; HOMOGENEOUS PRECIPITATION; SEM; TIME-OF-FLIGHT SECONDARY ION MASS SPECTROSCOPY; TOPOGRAPHICAL VARIATIONS;

ABRASIVES; AMMONIUM COMPOUNDS; ATOMIC FORCE MICROSCOPY; CHEMICAL MECHANICAL POLISHING; HARD DISK STORAGE; NANOCOMPOSITES; PHOSPHORUS; POLISHING; SCANNING ELECTRON MICROSCOPY; SECONDARY ION MASS SPECTROMETRY; SILICA; SUBSTRATES; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

CHEMICAL POLISHING;

EID: 77955228245     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.10.006     Document Type: Conference Paper

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