Two-step chemical-mechanical polishing of rigid disk substrate to get atom-scale planarization surface

Chinese Journal of Mechanical Engineering (English Edition)

Volumn 19, Issue 4, 2006, Pages 496-499

  Lei, Hong ^a   Luo, Jianbin ^b   Lu, Xinchun ^b  

^a SHANGHAI UNIVERSITY   (China)

^b TSINGHUA UNIVERSITY   (China)

Author keywords

Atom scale planarization; Chemical mechanical polishing; Rigid disk substrate; Slurry; Two steps

Indexed keywords

ALUMINA; CHEMICAL MECHANICAL POLISHING; DEFECTS; NANOSTRUCTURED MATERIALS; OPTIMIZATION; SILICA; SLURRIES; SUBSTRATES; SURFACE ROUGHNESS;

ATOM SCALE PLANARIZATION; MATERIAL REMOVAL; RIGID DISK SUBSTRATE; WAVINESS;

MAGNETIC DISK STORAGE;

EID: 33846531656     PISSN: 10009345     EISSN: None     Source Type: Journal    
DOI: 10.3901/cjme.2006.04.496     Document Type: Article

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