SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 365-371

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

(7) Made, Riko I a,b,c Gan, Chee Lip a,b Yan, Li Ling c Yu, Aibin c Yoon, Seung Wook c Lau, John H c Lee, Chengkuo d

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

b SINGAPORE MIT ALLIANCE (Singapore)

c INSTITUTE OF MICROELECTRONICS (Singapore)

d NATIONAL UNIVERSITY OF SINGAPORE (Singapore)

Author keywords

IC; Indium; Low temperature solder; MEMS; Packaging

Indexed keywords

BONDED JOINTS; BONDING PRESSURES; ELECTROMECHANICAL SYSTEMS; IC; INTERMETALLIC COMPOUNDS; LOW-TEMPERATURE SOLDER; MELTING TEMPERATURES; PACKAGING APPLICATIONS; RESULTING JOINTS; RICH PHASE;

BRAZING; CHIP SCALE PACKAGES; ELECTROMECHANICAL DEVICES; ELECTRONIC EQUIPMENT MANUFACTURE; INDIUM; INTEGRATED CIRCUITS; INTERMETALLICS; MELTING POINT; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE EFFECTS; SILVER; WELDING;

SOLDERING ALLOYS;

EID: 58349104327 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0555-8 Document Type: Article

Times cited : (50)

References (14)

1
- 51249170304
- 10.1007/BF02651374
- F. Bartels J. Morris G. Dalke W. Gust 1994 J. Electron. Mater. 23 787 10.1007/BF02651374
- (1994) J. Electron. Mater. , vol.23 , pp. 787
- Bartels, F.¹ Morris, J.² Dalke, G.³ Gust, W.⁴

2
- 0033149165
- 10.1016/S0040-6090(98)01737-4
- F.S. Shieu C.F. Chen J.G. Sheen Z.C. Chang 1999 Thin Solid Films 346 125 10.1016/S0040-6090(98)01737-4
- (1999) Thin Solid Films , vol.346 , pp. 125
- Shieu, F.S.¹ Chen, C.F.² Sheen, J.G.³ Chang, Z.C.⁴

3
- 0037158403
- 10.1016/S0040-6090(02)00424-8
- R.W. Chuang C.C. Lee 2002 Thin Solid Films 414 175 10.1016/S0040-6090(02) 00424-8
- (2002) Thin Solid Films , vol.414 , pp. 175
- Chuang, R.W.¹ Lee, C.C.²

4
- 41149124872
- doi: 10.1117/12.762046
- R.I. Made, C.L. Gan, C. Lee, L.L. Yan, Ai. Yu, S.W. Yoon, and J.H. Lau, Proc. SPIE 6884, 68810H (2008). doi: 10.1117/12.762046.
- (2008) Proc. SPIE , vol.6884
- Made, R.I.¹ Gan, C.L.² Lee, C.³ Yan, L.L.⁴ Yu, Ai.⁵ Yoon, S.W.⁶ Lau, J.H.⁷

5
- 0036573714
- 10.1016/S0040-6090(02)00240-7
- J.-C. Lin L.-W. Huang G.-Y. Jang S.-L. Lee 2002 Thin Solid Films 410 212 10.1016/S0040-6090(02)00240-7
- (2002) Thin Solid Films , vol.410 , pp. 212
- Lin, J.-C.¹ Huang, L.-W.² Jang, G.-Y.³ Lee, S.-L.⁴

6
- 0004258899
- Material Park, OH: ASM International
- T.B. Massalski, H. Okamoto, P.R. Subramanian, and L. Kacprzak, ASM Handbook, Vol. 3 (Material Park, OH: ASM International, 1992)
- (1992) ASM Handbook , vol.3
- Massalski, T.B.¹ Okamoto, H.² Subramanian, P.R.³ Kacprzak, L.⁴

7
- 0026116734
- 10.1016/0040-6090(91)90241-O
- R. Roy S.K. Sen 1991 Thin Solid Films 197 303 10.1016/0040-6090(91)90241- O
- (1991) Thin Solid Films , vol.197 , pp. 303
- Roy, R.¹ Sen, S.K.²

8
- 0036768050
- 10.1109/TCAPT.2002.801113
- R.W. Chuang C.C. Lee 2002 IEEE Trans. Compon. Packag. Technol. 25 453 10.1109/TCAPT.2002.801113
- (2002) IEEE Trans. Compon. Packag. Technol. , vol.25 , pp. 453
- Chuang, R.W.¹ Lee, C.C.²

9
- 0018507042
- 10.1016/0040-6090(79)90457-7
- V. Simic Z. Marinkovic 1979 Thin Solid Films 61 149 10.1016/0040-6090(79) 90457-7
- (1979) Thin Solid Films , vol.61 , pp. 149
- Simic, V.¹ Marinkovic, Z.²

10
- 58349116918
- doi: 10.1098/rspa.1966.0242
- T.H. Chuang, Y.T. Huang, and L.C. Tsau, J. Electron. Mater. 30, (2001). doi: 10.1098/rspa.1966.0242.
- (2001) J. Electron. Mater. , vol.30
- Chuang, T.H.¹ Huang, Y.T.² Tsau, L.C.³

11
- 0000827365
- 10.1098/rspa.1966.0242
- J.A. Greenwood J.B.P. Williamson 1966 Proc. R. Soc. Lond. A 295 300 10.1098/rspa.1966.0242
- (1966) Proc. R. Soc. Lond. A , vol.295 , pp. 300
- Greenwood, J.A.¹ Williamson, J.B.P.²

12
- 36649036367
- 10.1063/1.2811724
- H.L. Leong C.L. Gan C.V. Thompson K.L. Pey H.Y. Li 2007 J. Appl. Phys. 102 103510 10.1063/1.2811724
- (2007) J. Appl. Phys. , vol.102 , pp. 103510
- Leong, H.L.¹ Gan, C.L.² Thompson, C.V.³ Pey, K.L.⁴ Li, H.Y.⁵

13
- 0004164057
- Translated and reprinted in English London: Macmillan & Co.
- H. Hertz and J. Regine Angew, Translated and reprinted in English in Hertz's Miscellaneous Paper (London: Macmillan & Co., 1986).
- (1986) Hertz's Miscellaneous Paper
- Hertz, H.¹ Regine Angew, J.²

14
- 0003482692
- Chapman & Hall London
- 14. D.A. Porter, K.E. Easterling, Phase Transformations in Metals and Alloys. Chapman & Hall, London UK, 1992.
- (1992) Phase Transformations in Metals and Alloys
- Porter, D.A.¹ Easterling, K.E.²

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