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Volumn 38, Issue 2, 2009, Pages 365-371

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

Author keywords

IC; Indium; Low temperature solder; MEMS; Packaging

Indexed keywords

BONDED JOINTS; BONDING PRESSURES; ELECTROMECHANICAL SYSTEMS; IC; INTERMETALLIC COMPOUNDS; LOW-TEMPERATURE SOLDER; MELTING TEMPERATURES; PACKAGING APPLICATIONS; RESULTING JOINTS; RICH PHASE;

EID: 58349104327     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0555-8     Document Type: Article
Times cited : (49)

References (14)
  • 3
  • 7
    • 0026116734 scopus 로고
    • 10.1016/0040-6090(91)90241-O
    • R. Roy S.K. Sen 1991 Thin Solid Films 197 303 10.1016/0040-6090(91)90241- O
    • (1991) Thin Solid Films , vol.197 , pp. 303
    • Roy, R.1    Sen, S.K.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.