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Volumn 38, Issue 2, 2009, Pages 365-371
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Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
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Author keywords
IC; Indium; Low temperature solder; MEMS; Packaging
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Indexed keywords
BONDED JOINTS;
BONDING PRESSURES;
ELECTROMECHANICAL SYSTEMS;
IC;
INTERMETALLIC COMPOUNDS;
LOW-TEMPERATURE SOLDER;
MELTING TEMPERATURES;
PACKAGING APPLICATIONS;
RESULTING JOINTS;
RICH PHASE;
BRAZING;
CHIP SCALE PACKAGES;
ELECTROMECHANICAL DEVICES;
ELECTRONIC EQUIPMENT MANUFACTURE;
INDIUM;
INTEGRATED CIRCUITS;
INTERMETALLICS;
MELTING POINT;
MEMS;
MICROELECTROMECHANICAL DEVICES;
PRESSURE EFFECTS;
SILVER;
WELDING;
SOLDERING ALLOYS;
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EID: 58349104327
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-008-0555-8 Document Type: Article |
Times cited : (49)
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References (14)
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