SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 2, 2009, Pages 365-371

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

(7) Made, Riko I a,b,c Gan, Chee Lip a,b Yan, Li Ling c Yu, Aibin c Yoon, Seung Wook c Lau, John H c Lee, Chengkuo d

a NANYANG TECHNOLOGICAL UNIVERSITY (Singapore)

b SINGAPORE MIT ALLIANCE (Singapore)

c INSTITUTE OF MICROELECTRONICS (Singapore)

d NATIONAL UNIVERSITY OF SINGAPORE (Singapore)

Author keywords

IC; Indium; Low temperature solder; MEMS; Packaging

Indexed keywords

BONDED JOINTS; BONDING PRESSURES; ELECTROMECHANICAL SYSTEMS; IC; INTERMETALLIC COMPOUNDS; LOW-TEMPERATURE SOLDER; MELTING TEMPERATURES; PACKAGING APPLICATIONS; RESULTING JOINTS; RICH PHASE;

BRAZING; CHIP SCALE PACKAGES; ELECTROMECHANICAL DEVICES; ELECTRONIC EQUIPMENT MANUFACTURE; INDIUM; INTEGRATED CIRCUITS; INTERMETALLICS; MELTING POINT; MEMS; MICROELECTROMECHANICAL DEVICES; PRESSURE EFFECTS; SILVER; WELDING;

SOLDERING ALLOYS;

EID: 58349104327 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-008-0555-8 Document Type: Article

Times cited : (49)

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