A hermetic seal using composite thin-film In/Sn solder as an intermediate layer and its interdiffusion reaction with Cu

Journal of Electronic Materials

Volumn 38, Issue 1, 2009, Pages 200-207

  Yan, Li Ling ^a   Lee, Cheng Kuo ^a,b   Yu, Da Quan ^a   Yu, Ai Bin ^a   Choi, Won Kyoung ^a   Lau, John H ^a   Yoon, Seung Uk ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

Copper; In Sn solder; Interfacial reaction; Intermetallic compounds; Low temperature bonding

Indexed keywords

BOND FORMATIONS; BONDING CONDITIONS; BONDING INTERFACES; BONDING JOINTS; BONDING STRENGTHS; BONDING TEMPERATURES; CHEMICAL COMPOSITION ANALYSES; COMPOSITE SOLDERS; CROSS SECTIONS; CU METALLIZATION; HELIUM LEAK RATES; IN/SN SOLDER; INTER-LAYERS; INTERDIFFUSION REACTIONS; INTERFACIAL BONDING STRENGTHS; INTERFACIAL REACTION; INTERMEDIATE LAYERS; INTERMETALLIC COMPOUNDS; LOW-TEMPERATURE BONDING; OPTIMAL CONDITIONS; SERVICE TEMPERATURES;

ACOUSTIC HOLOGRAPHY; ACOUSTIC IMAGING; BONDING; BRAZING; CHEMICAL BONDS; DIFFUSION BONDING; ELECTROCHEMICAL ELECTRODES; HELIUM; HERMETIC SEALS; INERT GASES; INTERMETALLICS; PHASE DIAGRAMS; PHASE INTERFACES; SCANNING; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; THEOREM PROVING; TIN; TRANSMISSION ELECTRON MICROSCOPY; WELDING; X RAY ANALYSIS; X RAY DIFFRACTION ANALYSIS;

COPPER;

EID: 57649222007     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0561-x     Document Type: Conference Paper

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