Development of low temperature bonding using in-based solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 1294-1299

  Choi, Won Kyoung ^a   Yu, Daquan ^a   Lee, Chengkuo ^a,b   Yan, Liling ^a   Yu, Aibin ^a   Yoon, Seung Wook ^a   Lau, John H ^a   Cho, Moon Gi ^c   Jo, Yoon Hwan ^c   Lee, Hyuck Mo ^c  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONIC COMPONENTS; LOW-TEMPERATURE BONDING;

BONDING;

EID: 51349084691     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550142     Document Type: Conference Paper

References (14)

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