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Volumn 36, Issue 9, 2007, Pages 1121-1128

Interfacial reactions in Sn-0.7wt.%Cu/Ni-V couples at 250°C

Author keywords

Intermetallic compound; Ni V; Soldering

Indexed keywords

SN-RICH PHASES; SUBSTRATE COUPLES; UNDER-BUMP METALLURGY;

FLIP CHIP DEVICES; NUCLEATION; SUBSTRATES; SURFACE CHEMISTRY; TIN METALLURGY;

INTERMETALLICS;

EID: 34548205410 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-007-0200-y Document Type: Article

Times cited : (16)

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