Nickel silicon thin film as barrier in under-bump-metallization by magnetron sputtering deposition for Pb-free chip packaging

Journal of Materials Research

Volumn 20, Issue 10, 2005, Pages 2622-2626

  Li, Yanping ^a   Chen, J ^a   Lazik, C ^a   Wang, P ^a   Yang, L ^a   Yu, J ^a   Sun, T ^b   Ko, E ^b  

^a APPLIED MATERIALS INC   (United States)

^b SILICONWARE PRECISION INDUSTRIES CO LTD   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

AGING OF MATERIALS; AUGER ELECTRON SPECTROSCOPY; CHIP SCALE PACKAGES; INTERMETALLICS; MAGNETRON SPUTTERING; METALLIZING; POLYCRYSTALLINE MATERIALS; SOLDERED JOINTS; SPUTTER DEPOSITION; THIN FILMS; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

BALL SHEARING; LEAD-FREE CHIP PACKAGING; NICKEL SILICON ALLOY; PULL TESTING; THERMAL AGING TESTS; UNDER-BUMP-METALLIZATION BARRIER;

NICKEL ALLOYS;

EID: 29144532570     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/JMR.2005.0346     Document Type: Article

References (11)

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