Alternative UBM for lead free solder bumping using C4NP

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 15-21

  Ruhmer, Klaus ^a   Laine, Eric ^a   O'Donnell, Kathy ^b   Kostetsky, John ^b   Hauck, Karin ^c   Manessis, Dionysios ^c   Ostmann, Andreas ^c   Toepper, Michael ^c   Juergensen, Nils ^c  

^a SUSS MicroTec Lithography GmbH   (United States)

^b Nexx Systems   (United States)

^c FRAUNHOFER IZM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BUMP TRANSFER TECHNOLOGY; FLIP CHIP INTERCONNECT;

ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; MICROELECTRONICS; WSI CIRCUITS;

SOLDERING ALLOYS;

EID: 35348918780     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373770     Document Type: Conference Paper

References (3)

1. "Microelectronic Packaging (Chapter 25)" M. Töpper, D. Tönnies in Semiconductor Manufacturing Handbook (M.h. Geng, Ed.), McGraw-Hill, 2005
2. "Stress Control in NiV, Cr and TiW Thin Films used in UBM and Backside Metallization" K. O'Donnell, J. Kostetsky and R.S. Post, IMAPS Flip Chip Advanced Technology Workshop, Austin TX June 2002.
3. "A sputtered nickel under bump metallurgy structure for lead-free solder for use in flip chip packaging" K. O'Donnell, J. Kostetsky, R. Devito, V. Bellido-Gonzalez, S. Powell and D. Monaghan, IMAPS Flip Chip Advanced Technology Workshop, Austin TX June 2003.