Comparative study of drop reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 957-961

  Jee, Y K ^a   Ko, Y H ^a   Yu, Jin ^b   Lee, T Y ^a   Cho, M K ^a   Lee, H M ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Hanbat National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROLESS PLATING; GOLD ALLOYS; METALLIZING; NICKEL ALLOYS; RELIABILITY; SURFACE CHEMISTRY; THERMAL AGING; ZINC ALLOYS;

CU PAD; DROP RELIABILITY; DROP RESISTANCE; SUPPRESSED GROWTH;

SOLDERING ALLOYS;

EID: 35348901916     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373912     Document Type: Conference Paper

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