Calorimetric study of the energetics and kinetics of interdiffusion in Cu/Cu6Sn5 thin film diffusion couples

Materials Research Society Symposium - Proceedings

Volumn 398, Issue , 1996, Pages 313-318

  Neils, W K ^a   Chromik, R R ^a   Dreyer, K F ^a   Grosman, D ^a   Cotts, E J ^a  

^a BINGHAMTON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHARACTERIZATION; COPPER; COPPER ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; ENTHALPY; EVAPORATION; INTERMETALLICS; MULTILAYERS; NUCLEATION; REACTION KINETICS; STOICHIOMETRY; THIN FILMS;

BOLTZMANNS CONSTANT; ENERGETICS; SOLDER METAL DIFFUSION COUPLES; THERMAL EVAPORATION;

INTERDIFFUSION (SOLIDS);

EID: 0029766761     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (14)