Kinetics of interface reaction in 40Sn-Bi/Cu and 40Sn-Bi-2Ag/Cu systems during aging in solid state

IEEE Transactions on Advanced Packaging

Volumn 23, Issue 4, 2000, Pages 737-742

  Guan, Zhuo Ming ^a   Liu, Guo Xun ^a   Liu, Tao ^b  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; METALLOGRAPHY; REACTION KINETICS; SILVER; SOLDERING; SOLDERING ALLOYS; TIN ALLOYS;

HOT IMMERSION; MOLTEN SOLDER BATH; QUANTITATIVE METALLOGRAPHIC ANALYSIS; THICKENING KINETICS; TIME EXPONENT;

AGING OF MATERIALS;

EID: 0034317695     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/6040.883766     Document Type: Article

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