Formation of crack-like diffusion wedges and compressive stress evolution during thin film growth with inhomogeneous grain boundary diffusivity

International Journal of Applied Mechanics

Volumn 1, Issue 1, 2009, Pages 1-19

  Bhandakkar, Tanmay K ^a   Chason, Eric ^a   Gao, Huajian ^a  

^a Brown University   (United States)

Author keywords

diffusion; Grain boundary; hypersingular integral equation; thin film stresses; Volmer Weber growth

Indexed keywords

ANNEALING CONDITION; COALESCENCE STRESS; CRACK-LIKE; DIFFUSION TIME; FILM DEPOSITION; FILM SURFACES; FILM-SUBSTRATE INTERFACES; FULLY-COUPLED; GRAIN BOUNDARY DIFFUSIVITY; GRAIN-BOUNDARY DIFFUSION; GROWTH INTERRUPTION; HIGH MOBILITY; HYPERSINGULAR; HYPERSINGULAR INTEGRAL EQUATION; MOVING BOUNDARIES; NUMERICAL SCHEME; POLYCRYSTALLINE THIN FILM; STEADY STATE STRESS; STRESS EVOLUTION; STRESS-THICKNESS; TEMPORAL DECAY; THIN FILM STRESSES;

COALESCENCE; COMPRESSIVE STRESS; CRACKS; DEPOSITION RATES; DIFFERENTIAL EQUATIONS; DIFFERENTIATION (CALCULUS); DIFFUSION; ELASTICITY; GRAIN BOUNDARIES; GRAIN GROWTH; INTEGRAL EQUATIONS; INTEGRODIFFERENTIAL EQUATIONS; SINGLE CRYSTALS; STRESS CONCENTRATION; THIN FILMS; VAPOR DEPOSITION;

FILM GROWTH;

EID: 77953486699     PISSN: 17588251     EISSN: 1758826X     Source Type: Journal    
DOI: 10.1142/S1758825109000071     Document Type: Article

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