Atomic diffusion from a material surface into a grain boundary

Proceedings of the Royal Society A: Mathematical, Physical and Engineering Sciences

Volumn 458, Issue 2023, 2002, Pages 1673-1694

  Antipov, Y A ^a   Gao, H ^a  

^a University of Bath   (United Kingdom)

Author keywords

Atomic diffusion; Grain boundary; Integro differential equation; Riemann Hilbert problem; Thin films

Indexed keywords

EID: 67049136056     PISSN: 13645021     EISSN: None     Source Type: Journal    
DOI: 10.1098/rspa.2001.0925     Document Type: Article

References (17)

1. Exact solution of integro-differential equations of diffusion along grain boundary
2. On stress singularities and interfaces in linear elastic fracture mechanics
3. Mixed boundary-value problems in non-homogeneous elastic materials
4. Contact problem for a wedge with an elastic support
5. A normally solvable equation of smooth transition
6. Boundary problems
7. Crack-like grain boundary diffusion wedges in thin metal films
8. Quantitative analysis of strengthening mechanisms in thin Cu films: Effects of film thickness, grain size, and passivation
9. The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films
10. On the diffusion of load from a stiffener into a sheet
11. Behaviour of the Cauchy integral near points of discontinuity of density and a singular case of the Riemann boundary value problem
12. Two-dimensional problem of the contact between a semi-infinite beam and an elastic wedge
13. Energy variations in diffusive cavity growth
14. Stress development and relaxation in copper thin films during thermal cycling
15. Thermal strain and stress in copper thin films
16. Constrained diffusional creep in UHV-produced copper thin films