-
1
-
-
47949104084
-
Dual-mode high-speed data transmission using substrate integrated waveguide interconnects
-
EPEP, Atlanta, GA, Oct. 29-31
-
A. Suntives and R. Abhari, "Dual-mode high-speed data transmission using substrate integrated waveguide interconnects," in Proc. 16th IEEE Electr. Perform. Electron. Packag. (EPEP 2007), Atlanta, GA, Oct. 29-31, pp. 215-218.
-
(2007)
Proc. 16th IEEE Electr. Perform. Electron. Packag.
, pp. 215-218
-
-
Suntives, A.1
Abhari, R.2
-
2
-
-
0026705936
-
Characterization of resistive transmission lines by short-pulse propagation
-
Jan
-
A. Deutsch, G. Arjavalingam, and G. V. Kopcsay, "Characterization of resistive transmission lines by short-pulse propagation," IEEE Microw. Guided Wave Lett., vol. 2, no. 1, pp. 25-27, Jan. 1992.
-
(1992)
IEEE Microw. Guided Wave Lett.
, vol.2
, Issue.1
, pp. 25-27
-
-
Deutsch, A.1
Arjavalingam, G.2
Kopcsay, G.V.3
-
3
-
-
0027559006
-
Characterization of resistive transmission lines to 70 GHz with ultra-fast optoelectronics
-
Mar. 1993
-
A. Deutsch, M. R. Scheuermann, G. Arjavalingam, L. Kneller, J. K. Tam, and C. W. Surovic, "Characterization of resistive transmission lines to 70 GHz with ultra-fast optoelectronics," IEEE Microw. Guided Wave Lett., vol. 3, no. 3, pp. 75-77, Mar. 1993.
-
IEEE Microw. Guided Wave Lett.
, vol.3
, Issue.3
, pp. 75-77
-
-
Deutsch, A.1
Scheuermann, M.R.2
Arjavalingam, G.3
Kneller, L.4
Tam, J.K.5
Surovic, C.W.6
-
5
-
-
44449116243
-
Practical considerations in the modeling and characterization of printed-circuit board wiring
-
SPI, Berlin, Germany, May 10-13
-
A. Deutsch, R. S. Krabbenhoft, C. W. Surovic, T.-M. Winkel, C. Schuster, Y. H. Kwark, and E. Klink, "Practical considerations in the modeling and characterization of printed-circuit board wiring," in Proc. Signal Propag. Interconnects (SPI 2006), Berlin, Germany, May 10-13, pp. 1-4.
-
(2006)
Proc. Signal Propag. Interconnects
, pp. 1-4
-
-
Deutsch, A.1
Krabbenhoft, R.S.2
Surovic, C.W.3
Winkel, T.-M.4
Schuster, C.5
Kwark, Y.H.6
Klink, E.7
-
6
-
-
77952745194
-
-
Online. Available
-
[Online]. Available: http://www.ipc.org?/ContentPage.aspx?Pageid=4.1.0.5
-
-
-
-
7
-
-
13944268275
-
Extraction of e'r (f) and tand (f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique
-
Feb
-
A. Deutsch, T-M. Winkel, G. V. Kopcsay, C. W. Surovic, B. J. Rubin, G. A. Katopis, B. J. Chamberlin, and R. S. Krabbenhoft, "Extraction of e'r (f) and tand (f) for printed circuit board insulators up to 30 GHz using the short-pulse propagation technique," IEEE Trans. Adv. Packag., vol. 28, no. 1, pp. 4-9, Feb. 2005.
-
(2005)
IEEE Trans. Adv. Packag.
, vol.28
, Issue.1
, pp. 4-9
-
-
Deutsch, A.1
Winkel, T.-M.2
Kopcsay, G.V.3
Surovic, C.W.4
Rubin, B.J.5
Katopis, G.A.6
Chamberlin, B.J.7
Krabbenhoft, R.S.8
-
8
-
-
77952745357
-
-
Online. Available
-
[Online]. Available: www.picosecond.com
-
-
-
-
9
-
-
77952743314
-
-
Online. Available
-
[Online]. Available: www.alphaworks.ibm.com/tech/eip
-
-
-
-
10
-
-
0014710239
-
Calculation of coefficients of capacitance of multiconductor transmission lines in the presence of dielectric interface
-
Jan. 1970
-
W. T. Weeks, "Calculation of coefficients of capacitance of multiconductor transmission lines in the presence of dielectric interface," IEEE Trans. Microw. Theory Tech., vol. MTT-18, no. 1, pp. 35-43, Jan. 1970.
-
IEEE Trans. Microw. Theory Tech.
, vol.MTT-18
, Issue.1
, pp. 35-43
-
-
Weeks, W.T.1
-
11
-
-
51349147141
-
The viability of 25 Gb/s on-board signaling
-
ECTC, Lake Buena Vista, FL, May 27-30
-
M. B. Ritter, P. Pepeljugoski, X. Gu, Y. Kwark, D. Kam, R. Rimolo-Donadio, B. Wu, C. Baks, R. John, L. Shan, and C. Schuster, "The viability of 25 Gb/s on-board signaling," in Proc. 58th IEEE Electron. Compon. Technol. Conf. (ECTC 2008), Lake Buena Vista, FL, May 27-30, pp. 1121-1127.
-
(2008)
Proc. 58th IEEE Electron. Compon. Technol. Conf
, pp. 1121-1127
-
-
Ritter, M.B.1
Pepeljugoski, P.2
Gu, X.3
Kwark, Y.4
Kam, D.5
Rimolo-Donadio, R.6
Wu, B.7
Baks, C.8
John, R.9
Shan, L.10
Schuster, C.11
-
12
-
-
33845912665
-
Comparison of time- and frequency-domain measurement results for product related card and MCM transmission lines up to 65 GHz
-
EPEP, Austin, TX, Oct. 24-26
-
T.-M. Winkel, A. Deutsch, G. A. Katopis, G. V. Kopcsay, E. Klink, W. D. Dyckman, B. J. Chamberlin, H. Grabinski, C. W. Surovic, H. Liu, and C. Baks, "Comparison of time- and frequency-domain measurement results for product related card and MCM transmission lines up to 65 GHz," in Proc. IEEE 14th Electr. Perform. Electron. Packag. (EPEP 2005), Austin, TX, Oct. 24-26, pp. 21-24.
-
(2005)
Proc. IEEE 14th Electr. Perform. Electron. Packag
, pp. 21-24
-
-
Winkel, T.-M.1
Deutsch, A.2
Katopis, G.A.3
Kopcsay, G.V.4
Klink, E.5
Dyckman, W.D.6
Chamberlin, B.J.7
Grabinski, H.8
Surovic, C.W.9
Liu, H.10
Baks, C.11
-
13
-
-
0034480254
-
Network analyzer calibration methods for high-density packaging characterization and validation of simulation models
-
Jun. 26-30
-
C. L. Hammond and K. L. Virga, "Network analyzer calibration methods for high-density packaging characterization and validation of simulation models," in Proc. 50th Electron. Compon. Technol. Conf, Jun. 26-30, pp. 519-525.
-
Proc. 50th Electron. Compon. Technol. Conf
, pp. 519-525
-
-
Hammond, C.L.1
Virga, K.L.2
-
14
-
-
58049096973
-
An analysis on measurement sensitivity of short-pulse propagation technique using a virtual test bench
-
EPEP, San Jose, CA, Oct. 27-29
-
Z. Zhou, A. Deutsch, K. L. Melde, G. A. Katopis, and J. D. Morsey, "An analysis on measurement sensitivity of short-pulse propagation technique using a virtual test bench," in Proc. 17th IEEE Electr. Perform. Electron. Packag. (EPEP 2008), San Jose, CA, Oct. 27-29, pp. 213-216.
-
(2008)
Proc. 17th IEEE Electr. Perform. Electron. Packag
, pp. 213-216
-
-
Zhou, Z.1
Deutsch, A.2
Melde, K.L.3
Katopis, G.A.4
Morsey, J.D.5
-
15
-
-
34047239114
-
The recessed probe launch - A new signal launch for high-frequency characterization of board level packaging
-
Santa Clara, CA, Jan. 31-Feb. 3
-
Y. Kwark, C. Schuster, L. Shan, C. Baks, and J. Trewhella, "The recessed probe launch - a new signal launch for high-frequency characterization of board level packaging," IEC DesignCon, Santa Clara, CA, Jan. 31-Feb. 3, 2005, pp. 20-40.
-
(2005)
IEC DesignCon
, pp. 20-40
-
-
Kwark, Y.1
Schuster, C.2
Shan, L.3
Baks, C.4
Trewhella, J.5
-
16
-
-
51849102587
-
Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring
-
SPI, Avignon, France, May 12-15, Online. Available
-
A. Deutsch, R. Krabbenhoft, C. W. Surovic, B. Rubin, and T.-M. Winkel, "Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring," in Proc. 12th IEEE Workshop Signal Propag. Interconnects (SPI 2008), Avignon, France, May 12-15, pp. 22-26. [Online]. Available: http://www.matrixusa.us/pdfs/Data%20Sheet%20Megtron6.pdf
-
(2008)
Proc. 12th IEEE Workshop Signal Propag. Interconnects
, pp. 22-26
-
-
Deutsch, A.1
Krabbenhoft, R.2
Surovic, C.W.3
Rubin, B.4
Winkel, T.-M.5
-
17
-
-
61649110276
-
Three-dimensional silicon integration
-
J. U. Knickerbocker et al., "Three-dimensional silicon integration," IBM J. Res. Dev., vol. 52, no. 6, pp. 553-570, 2008.
-
(2008)
IBM J. Res. Dev.
, vol.52
, Issue.6
, pp. 553-570
-
-
Knickerbocker, J.U.1
-
18
-
-
24644517719
-
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- and multichip modules
-
ECTC, Lake Buena Vista, FL, May 31-Jun. 5
-
S. Chun, A. Haridass, A. Deutsch, B. Rubin, C. Surovic, E. Klink, D. O'Connor, L. Hsichang C. Spring, T.-M. Winkel, W Dyckman, G. Katopis, and G. Kopcsay, "Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- and multichip modules," in Proc. 55th Electr. Compon. Technol. Conf. (ECTC 2005), Lake Buena Vista, FL, May 31-Jun. 5, pp. 20-27.
-
(2005)
Proc. 55th Electr. Compon. Technol. Conf
, pp. 20-27
-
-
Chun, S.1
Haridass, A.2
Deutsch, A.3
Rubin, B.4
Surovic, C.5
Klink, E.6
O'Connor, D.7
Hsichang, L.8
Spring, C.9
Winkel, T.-M.10
W Dyckman11
Katopis, G.12
Kopcsay, G.13
-
19
-
-
0031999149
-
Electrical characteristics of interconnections for highperformance systems
-
Feb
-
A. Deutsch, "Electrical characteristics of interconnections for highperformance systems," Proc. IEEE, vol. 86, no. 2, pp. 315-355, Feb. 1998.
-
(1998)
Proc. IEEE
, vol.86
, Issue.2
, pp. 315-355
-
-
Deutsch, A.1
-
20
-
-
0036478947
-
Characterization and performance evaluation of differential shielded cables for multiGb/s data-rates
-
Feb
-
A. Deutsch, G. V. Kopcsay, C. W. Surovic, P. W. Coteus, A. P. Lanzetta, T. Takken, and P. W. Bond, "Characterization and performance evaluation of differential shielded cables for multiGb/s data-rates," IEEE Trans. Adv. Packg., vol. 25, no. 1, pp. 102-117, Feb. 2002.
-
(2002)
IEEE Trans. Adv. Packg.
, vol.25
, Issue.1
, pp. 102-117
-
-
Deutsch, A.1
Kopcsay, G.V.2
Surovic, C.W.3
Coteus, P.W.4
Lanzetta, A.P.5
Takken, T.6
Bond, P.W.7
-
22
-
-
0027228746
-
Electrical characterization and performance limits of a flexible cable
-
A. Deutsch et al., "Electrical characterization and performance limits of a flexible cable," IBM J. Res. Develop., vol. 37, pp. 22-38, 1993.
-
(1993)
IBM J. Res. Develop.
, vol.37
, pp. 22-38
-
-
Deutsch, A.1
-
23
-
-
77950639878
-
Fundamentals of a 3-D "Snowball" model for surface roughness power losses
-
SPI, Ruta di Camogli, Italy, May13-16
-
P. G. Huray, S. Hall, S. Pytel, F. Oluwafemi, R. Mellitz, D. Hua, and Y. Peng, "Fundamentals of a 3-D "Snowball" model for surface roughness power losses," Proc. Signal Propag. Interconnects (SPI 2007), Ruta di Camogli, Italy, May13-16, pp. 121-124.
-
(2007)
Proc. Signal Propag. Interconnects
, pp. 121-124
-
-
Huray, P.G.1
Hall, S.2
Pytel, S.3
Oluwafemi, F.4
Mellitz, R.5
Hua, D.6
Peng, Y.7
-
25
-
-
0038012473
-
Investigation of the impact of conductor surface roughness on interconnect frequency-dependent ohmic loss
-
ECTC, New Orleans, LA, Jun. 2-4
-
L. Proekt and A. C. Cangellaris, "Investigation of the impact of conductor surface roughness on interconnect frequency-dependent ohmic loss," in Proc. 53th Electron. Compon. Technol. Conf. (ECTC 2003), New Orleans, LA, Jun. 2-4, pp. 1004-1010.
-
(2003)
Proc. 53th Electron. Compon. Technol. Conf
, pp. 1004-1010
-
-
Proekt, L.1
Cangellaris, A.C.2
-
27
-
-
33847784606
-
Modeling effects of random rough interface on power absorption between dielectric and conductive medium in 3-D problem
-
Mar
-
X. Gu, L. Tsang, and H. Braunisch, "Modeling effects of random rough interface on power absorption between dielectric and conductive medium in 3-D problem," IEEE Trans. Microw. Theory Tech., vol. 55, no. 3, pp. 511-517, Mar. 2007.
-
(2007)
IEEE Trans. Microw. Theory Tech.
, vol.55
, Issue.3
, pp. 511-517
-
-
Gu, X.1
Tsang, L.2
Braunisch, H.3
-
28
-
-
34547455440
-
Estimation of roughness-induced power absorption from measured surface profile data
-
Jul
-
X. Gu, L. Tsang, and H. Braunisch, "Estimation of roughness-induced power absorption from measured surface profile data," IEEE Microw. Wireless Compon. Lett., vol. 17, no. 7, pp. 486-488, Jul. 2007.
-
(2007)
IEEE Microw. Wireless Compon. Lett.
, vol.17
, Issue.7
, pp. 486-488
-
-
Gu, X.1
Tsang, L.2
Braunisch, H.3
-
29
-
-
35348871225
-
Off-chip rough-metalsurface propagation loss modeling and correlation with measurements
-
ECTC, Reno, NV, May 29-Jun. 1
-
H. Braunisch, X. Gu, A. C. Bragado, and L. Tsang, "Off-chip rough-metalsurface propagation loss modeling and correlation with measurements," in Proc. 57th Electron. Compon. Technol. Conf. (ECTC 2007), Reno, NV, May 29-Jun. 1, pp. 785-792.
-
(2007)
Proc. 57th Electron. Compon. Technol. Conf
, pp. 785-792
-
-
Braunisch, H.1
Gu, X.2
Bragado, A.C.3
Tsang, L.4
-
30
-
-
34249821907
-
Prediction of losses caused by roughness of metallization in printed-circuit boards
-
May
-
A. Deutsch, C. W. Surovic, R. S. Krabbenhoft, G. V. Kopcsay, and B. J. Chamberlin, "Prediction of losses caused by roughness of metallization in printed-circuit boards," IEEE Trans. Adv. Packag., vol. 30, no. 2, pp. 279-287, May 2007.
-
(2007)
IEEE Trans. Adv. Packag.
, vol.30
, Issue.2
, pp. 279-287
-
-
Deutsch, A.1
Surovic, C.W.2
Krabbenhoft, R.S.3
Kopcsay, G.V.4
Chamberlin, B.J.5
-
31
-
-
15944371550
-
Modeling and mitigating AC common mode conversion in multiGb/s differential printed circuit boards
-
EPEP, Portland, OR, Oct. 25-27
-
H. Heck, S. Hall, B. Horine, and T. Liang, "Modeling and mitigating AC common mode conversion in multiGb/s differential printed circuit boards," in Proc. Dig. IEEE 13th Topical Meet. Elec. Perform. Electron. Packag. (EPEP 2004), Portland, OR, Oct. 25-27, pp. 29-32.
-
(2004)
Proc. Dig. IEEE 13th Topical Meet. Elec. Perform. Electron. Packag
, pp. 29-32
-
-
Heck, H.1
Hall, S.2
Horine, B.3
Liang, T.4
|