Practical considerations in the modeling and characterization of printed-circuit board wiring

Proceedings - 10th IEEE Workshop on Signal Propagation on Interconnects, SPI 2006

Volumn , Issue , 2006, Pages 119-122

  Deutsch, A ^a   Krabbenhoft, R S ^a,b   Surovic, C W ^a   Winkel, T M ^a,c   Schuster, C ^a   Kwark, Y H ^a   Klink, E ^a,c  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c IBM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

BANDWIDTH; CHARACTERIZATION; DIELECTRIC LOSSES; NETWORK ARCHITECTURE; SYSTEMS ANALYSIS;

MEASUREMENT METHODOLOGY; OFFLINE MONITORING; PRINTED-CIRCUIT BOARD WIRING;

PRINTED CIRCUIT BOARDS;

EID: 44449116243     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2006.289144     Document Type: Conference Paper

References (6)

1. G. Katopis, "Signal Interconnect Trends and Challenges Inside the CEC", http://www.ewh.ieee.org/soc/cpmt/tc12/
2. T-M. Winkel et al., "Comparison of Time- and Frequency-Domain Measurement Results for Product Related Card and MCM Transmission Lines up to 65 GHz", Digest of EPEP'O5, Oct. 24-26, 2005, Austin, TX, pp.21-24.
3. W. Weeks, "Calculation of Coefficients of Capacitance of Multiconductor Transmisison Lines in the Presence of Dielectric Interface", IEEE Trans. Micr. Th. Tech., MTT-21, pp.76-82, 1973.
4. r(f) and tanδ(f) for Printed-Circuit Board Insulators up to 30 GHz Using the Short-Pulse Propagation Technique", IEEE Trans. Adv. Packg, vol. 28, no. 1, Feb. 2005.
5. A. Deutsch, et al, "Losses Caused by Roughness of Metallization in Printed-Circuit Boards", Digest of EPEP'O5, Oct. 24-26, 2005, Austin, TX, pp. 39-42.
6. Polar Instruments, http://www.polarinstruments.com/.