메뉴 건너뛰기




Volumn 2005, Issue , 2005, Pages 21-24

Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MCM TEST LINE STRUCTURES; FIELD CALCULATIONS; LOW LOSS CARDS; MATERIAL PARAMETERS;

EID: 33845912665     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563690     Document Type: Conference Paper
Times cited : (6)

References (8)
  • 2
    • 0026705936 scopus 로고
    • Characterization of resistive transmission lines by short-pulse propagation
    • Jan.
    • A. Deutsch, G. Arjavalingam, G. V. Kopcsay, "Characterization of resistive transmission lines by short-pulse propagation", IEEE Microwave Guided Wave Lett., vol. 2, pp.25-27, Jan. 1992.
    • (1992) IEEE Microwave Guided Wave Lett. , vol.2 , pp. 25-27
    • Deutsch, A.1    Arjavalingam, G.2    Kopcsay, G.V.3
  • 4
    • 0029771322 scopus 로고    scopus 로고
    • An accurate determination of the characteristic impedance of lossy lines on chips based on high frequency S-parameter measurements
    • February
    • Thomas-Michael Winkel, Lohit Sagar Dutta, Hartmut Grabinski, "An Accurate Determination of the Characteristic Impedance of Lossy Lines on Chips Based on High Frequency S-Parameter Measurements", IEEE Multi-Chip Module Conference MCMC'96, pp. 190-195, February 1996
    • (1996) IEEE Multi-chip Module Conference MCMC'96 , pp. 190-195
    • Winkel, T.-M.1    Dutta, L.S.2    Grabinski, H.3
  • 6
    • 0024000026 scopus 로고
    • Propagation constant determination in microwave fixture de-embedding procedure
    • April
    • Jyoti P. Mondai, Tzu-Hung Chen, "Propagation constant determination in microwave fixture de-embedding procedure", IEEE Transactions on Microwave Theory and Techniques, Vol. 36, No. 4, April 1988
    • (1988) IEEE Transactions on Microwave Theory and Techniques , vol.36 , Issue.4
    • Mondai, J.P.1    Chen, T.-H.2
  • 7
    • 0027798939 scopus 로고
    • High-speed VLSI interconnect modelling based on S-parameter measurements
    • Aug.
    • Y. Eo and W. R. Eisenstadt, "High-speed VLSI interconnect modelling based on S-parameter measurements," IEEE Trans. Comp., Hybrids, Manuf. Technol., vol. 16, pp. 555-562, Aug. 1993.
    • (1993) IEEE Trans. Comp., Hybrids, Manuf. Technol. , vol.16 , pp. 555-562
    • Eo, Y.1    Eisenstadt, W.R.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.