Electrical characteristics of interconnections for high-performance systems

Proceedings of the IEEE

Volumn 86, Issue 2, 1998, Pages 315-355

  Deutsch, Alina ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

Attenuation measurement; Cables; Connectors; Coupled transmission lines; Cross talk

Indexed keywords

BANDWIDTH; CROSSTALK; ELECTRIC IMPEDANCE MEASUREMENT; ELECTRIC LOSSES; ELECTROMAGNETIC WAVE ATTENUATION; ELECTROMAGNETIC WAVE PROPAGATION; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; SKIN EFFECT; TELECOMMUNICATION LINES;

ELECTROMAGNETIC COUPLINGS;

INTERCONNECTION NETWORKS;

EID: 0031999149     PISSN: 00189219     EISSN: None     Source Type: Journal    
DOI: 10.1109/5.659489     Document Type: Article

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