Use of the SPP technique to account for inhomogeneities in differential printed-circuit-board wiring

12th IEEE Workshop on Signal Propagation on Interconnects, SPI

Volumn , Issue , 2008, Pages

  Deutsch, A ^a   Krabbenhoft, Roger ^a,b   Surovic, C W ^a   Rubin, B ^a   Winkel, T M ^a,b  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPLEX PERMITTIVITY; DIFFERENTIAL LINES; INHOMOGENEITIES; INHOMOGENEOUS STRUCTURES; PREDICTIVE MODELING; SHORT PULSES; SIGNAL PROPAGATION; SOLDER MASKING; TIME-DOMAIN TECHNIQUES; TWO-STEP EXTRACTION;

CHLORINE COMPOUNDS; EPOXY RESINS; FIBER OPTICS; INTERCHANGES; PAINTING; PERMITTIVITY; PRINTED CIRCUITS; RESINS; SURFACE PLASMON RESONANCE; TELECOMMUNICATION SYSTEMS;

CRACK PROPAGATION;

EID: 51849102587     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SPI.2008.4558375     Document Type: Conference Paper

References (3)

1. th Topical Meeting Elec. Perf. Of Electronic Packaging, Portland, OR, Oct. 25-27, 2004, pp. 29-32.
2. r(f) and tanδ(f) for Printed-Circuit Board Insulators up to 30 GHz Using the Short-Pulse Propagation Technique", IEEE Trans. Adv. Packg, vol. 28, no. 1, pp. 4-12, Feb. 2005.
3. www.alphaworks.ibm.com/tech/eip