Thermal-aware job allocation and scheduling for three dimensional chip multiprocessor

Proceedings of the 11th International Symposium on Quality Electronic Design, ISQED 2010

Volumn , Issue , 2010, Pages 390-398

  Liu, Shaobo ^a   Zhang, Jingyi ^a   Wu, Qing ^a   Qiu, Qinru ^a  

^a State University of New York at Binghamton   (United States)

Author keywords

Chip multiprocessor; Job allocation; Scheduling; Thermal management; Three dimensional

Indexed keywords

A-THERMAL; CHIP MULTIPROCESSOR; CHIP MULTIPROCESSORS; HOT SPOT; JOB ALLOCATION; LOWER PEAK TEMPERATURES; PEAK TEMPERATURES; STANDARD DEVIATION; TEMPERATURE VARIATION; THERMAL CONDITION; THERMAL CONSTRAINTS; THERMAL MANAGEMENT; THREE-DIMENSIONAL (3D);

HEAT SINKS; MULTIPROCESSING SYSTEMS; TEMPERATURE CONTROL; TEMPERATURE DISTRIBUTION; THREE DIMENSIONAL;

SCHEDULING ALGORITHMS;

EID: 77952637166     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2010.5450547     Document Type: Conference Paper

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