The LER/LWR metrology challenge for advance process control through 3D-AFM and CD-SEM

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7520, Issue , 2009, Pages

  Faurie, P ^a   Foucher, J ^a   Foucher, A L ^a  

^a CEA LETI   (France)

Author keywords

3D AFM; Accuracy; CD SEM; LER; LWR; Metrology

Indexed keywords

ADVANCE PROCESS CONTROLS; AFM; AFM TIP; CRITICAL DIMENSION; DOUBLE GATE; GATE LENGTH; HIGH-K MATERIALS; IMMERSION RESISTS; INTERCONNECT MATERIALS; LINE EDGE ROUGHNESS; LINEWIDTH ROUGHNESS; METAL GATE MATERIALS; MICRO-ELECTRONIC DEVICES; NEW MATERIAL; NEW PROCESS; ON-WAFER; PRODUCTION YIELD; ROADMAP; SCATTEROMETRY; SEM; SIDEWALL ANGLES; SIDEWALL ROUGHNESS;

ATOMIC FORCE MICROSCOPY; DATA STORAGE EQUIPMENT; ELECTRON BEAMS; MATERIALS; MEASUREMENTS; MICROELECTRONICS; PHOTORESISTS; SILICON WAFERS; STANDARDIZATION; TECHNOLOGICAL FORECASTING; THREE DIMENSIONAL;

ROUGHNESS MEASUREMENT;

EID: 77952084666     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.837311     Document Type: Conference Paper

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