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Volumn 7272, Issue , 2009, Pages

The measurement uncertainty challenge for the future technological nodes production and development

Author keywords

3D AFM; Accuracy; CD SEM; OPC; Reference; Uncertainty; Yield

Indexed keywords

3D-AFM; ACCURACY; CD-SEM; OPC; REFERENCE; UNCERTAINTY; YIELD;

EID: 66649088013     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.812446     Document Type: Conference Paper
Times cited : (11)

References (9)
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  • 2
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  • 3
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  • 4
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    • The CD metrology perspectives and future trends
    • J.Foucher et al,"The CD metrology perspectives and future trends", Proc. SPIE 7140, 71400F (2008)
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    • Foucher, J.1
  • 5
    • 0141497106 scopus 로고    scopus 로고
    • Electron Beam Metrology of 193nm Resists at Ultra Low Voltage
    • N.Sullivan et al,"Electron Beam Metrology of 193nm Resists at Ultra Low Voltage", Proc. SPIE 5038, pp483-492, (2003)
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  • 6
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    • « Low Impact Resist Metrology: The use of ULV for high accuracy performance »
    • G.Sundaram et al, « Low Impact Resist Metrology : The use of ULV for high accuracy performance », Proc. SPIE 5375, pp675-685, (2004)
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  • 8
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    • Minimizing CD Measurement bias through Realtime Acquisition of 3D features Shapes
    • Foucher et al,"Minimizing CD Measurement bias through Realtime Acquisition of 3D features Shapes", Proc. SPIE 6152, 61521A, (2006)
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  • 9
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    • Characterization of CD-SEM Metrology for iArF Photoresist Materials
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.