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Volumn 157, Issue 3, 2010, Pages

Mechanism of sidewall necking and bowing in the plasma etching of high aspect-ratio contact holes

Author keywords

[No Author keywords available]

Indexed keywords

AR PLASMAS; B-Y IONS; CONTACT HOLES; ETCH PROFILE; FARADAY CAGE; HIGH ASPECT RATIO; LATERAL ETCHING; OVER-ETCHING; REDEPOSITION;

EID: 76349091392     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3276511     Document Type: Article
Times cited : (37)

References (26)
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  • 3
    • 25444531737 scopus 로고    scopus 로고
    • Profile control in high aspect ratio contact hole etching by a capacitively coupled plasma source
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    • Yen, T.F.1    Chang, K.J.2    Chiu, K.-F.3
  • 11
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    • Mask charging and profile evolution during chlorine plasma etching of silicon
    • DOI 10.1116/1.582157
    • K. H. A. Bogart, F. P. Klemens, M. V. Malyshev, J. I. Colonell, V. M. Donnelly, J. T. C. Lee, and J. M. Lane, J. Vac. Sci. Technol. A JVTAD6 0734-2101, 18, 197 (2000). 10.1116/1.582157 (Pubitemid 30896797)
    • (2000) Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films , vol.18 , Issue.1 , pp. 197-206
    • Bogart, K.H.A.1
  • 13
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    • (1990) J. Electrochem. Soc. , vol.137 , pp. 2837
    • Lii, Y.-T.1    Jorń, J.2
  • 25
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    • H. Hübner, J. Electrochem. Soc. JESOAN 0013-4651, 139, 3302 (1992). 10.1149/1.2069072
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    • Hübner, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.