Oblique-directional plasma etching of Si using a faraday cage

Journal of the Electrochemical Society

Volumn 156, Issue 7, 2009, Pages

  Lee, Jin Kwan ^a   Lee, Seung Haeng ^a   Min, Jae Ho ^a   Jang, Il Yong ^a   Kim, Chang Koo ^b   Moon, Sang Heup ^a  

^a Seoul National University   (South Korea)

^b Ajou University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ETCH DEPTH; ETCH PROFILE; FARADAY CAGE; FLUOROCARBON FILMS; HIGH ASPECT RATIO; HORIZONTAL GRID; INCIDENT ANGLES; PROCESS CONDITION; SAMPLE HOLDERS; SHADOWING EFFECTS; TILTED SUBSTRATE;

PHOTORESISTS; PLASMA ETCHING; PLASMAS; PRESSURE DROP; SILICON;

ASPECT RATIO;

EID: 65949099112     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3122623     Document Type: Article

References (19)

1. R. B. Bosch, U.S. Pat. 4,855,017 (1994); F. Laermer and A. Schilp, German Pat. 42,41,045CI (1990).
2. O. Toader, M. Berciu, and S. John, Phys. Rev. Lett. 0031-9007, 90, 233901 (2003). 10.1103/PhysRevLett.90.233901
3. K. K. Seet, V. Mizeikis, S. Juodkazis, and H. Misawa, Appl. Phys. Lett. 0003-6951, 88, 221101 (2006). 10.1063/1.2207841
4. M. Deubel, M. Wegener, A. Kaso, and S. John, Appl. Phys. Lett. 0003-6951, 85, 1895 (2004). 10.1063/1.1792802
5. C. C. Cheng and A. Scherer, J. Vac. Sci. Technol. B 1071-1023, 13, 2696 (1995). 10.1116/1.588051
6. S. Takahashi, M. Okano, M. Imada, and S. Noda, Appl. Phys. Lett. 0003-6951, 89, 123106 (2006). 10.1063/1.2355463
7. B. Aksak, M. P. Murphy, and M. Sitti, Langmuir 0743-7463, 23, 3322 (2007). 10.1021/la062697t
8. M. Boufnichel, S. Aachboun, P. Lefaucheux, and P. Ranson, J. Vac. Sci. Technol. B 1071-1023, 21, 267 (2003). 10.1116/1.1539063
9. Y. S. Chieh, J. P. Krusius, and P. Chapman, J. Electrochem. Soc. 0013-4651, 141, 1585 (1994). 10.1149/1.2054966
10. J. -K. Lee, G. -R. Lee, J. -H. Min, and S. H. Moon, J. Vac. Sci. Technol. A 0734-2101, 24, 1807 (2006). 10.1116/1.2221323
11. J. -K. Lee, G. -R. Lee, J. -H. Min, and S. H. Moon, J. Vac. Sci. Technol. A 0734-2101, 25, 1395 (2007). 10.1116/1.2757180
12. G. D. Boyd, L. A. Coldren, and F. G. Storz, Appl. Phys. Lett. 0003-6951, 36, 583 (1980). 10.1063/1.91554
13. J. -H. Min, G. -R. Lee, J. -K. Lee, C. -K. Kim, and S. H. Moon, J. Vac. Sci. Technol. A 0734-2101, 22, 661 (2004). 10.1116/1.1722680
14. B. -O. Cho, S. -W. Hwang, G. -R. Lee, and S. H. Moon, J. Vac. Sci. Technol. A 0734-2101, 18, 2791 (2000). 10.1116/1.1318193
15. J. -H. Min, J. -K. Lee, C. -K. Kim, and S. H. Moon, J. Vac. Sci. Technol. B 1071-1023, 23, 1405 (2005). 10.1116/1.1993623
16. F. F. Chen, Introduction to Plasma Physics and Controlled Fusion, Plenum, New York (1984).
17. B. Chapman, Glow Discharge Processes: Sputtering and Plasma Etching, John Wiley & Sons, New York (1980).
18. C. J. D. Craigie, T. Sheehan, V. N. Johnson, S. L. Burkett, A. J. Moll, and W. B. Knowlton, J. Vac. Sci. Technol. B 1071-1023, 20, 2229 (2002). 10.1116/1.1515910
19. J. Kiihamäki, J. Vac. Sci. Technol. A 0734-2101, 18, 1385 (2000). 10.1116/1.582359