Pure-silica LTA, CHA, STT, ITW, and -SVR thin films and powders for low-k applications

Microporous and Mesoporous Materials

Volumn 130, Issue 1-3, 2010, Pages 49-55

  Hunt, Heather K ^a   Lew, Christopher M ^b   Sun, Minwei ^b   Yan, Yushan ^b   Davis, Mark E ^a  

^a California Institute of Technology   (United States)

^b University of California Riverside   (United States)

Author keywords

SVR; Low k; STT; Thin films; Zeolite

Indexed keywords

-SVR; AMORPHOUS SILICA; DIELECTRIC CONSTANTS; EFFECTIVE MEDIUM MODEL; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; K-VALUES; LCR METERS; LOW DIELECTRIC CONSTANTS; LOW-K; MATERIAL APPLICATION; MECHANICAL POLISHING; METAL-INSULATOR-METAL STRUCTURES; MINERALIZING AGENTS; PARALLEL PLATES; POLYCRYSTALLINE; SI WAFER; SILICA ZEOLITES; SURFACE-MODIFIED; TIME-DOMAIN REFLECTOMETERS; TRANSMISSION LINE; VAPOR PHASE TRANSPORT;

AMORPHOUS MATERIALS; CAPACITANCE MEASUREMENT; FIELD EMISSION; FIELD EMISSION MICROSCOPES; METAL INSULATOR BOUNDARIES; PERMITTIVITY; PLATE METAL; POWDER METALS; REFLECTOMETERS; SCANNING ELECTRON MICROSCOPY; SILICA; SILICATE MINERALS; SILICON WAFERS; THERMOANALYSIS; THIN FILMS; TOPOLOGY; ZEOLITES;

SEMICONDUCTING SILICON COMPOUNDS;

EID: 76049127112     PISSN: 13871811     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.micromeso.2009.10.011     Document Type: Article

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