Pure-silica zeolite thin films by vapor phase transport of fluoride for low-k applications

Microporous and Mesoporous Materials

Volumn 128, Issue 1-3, 2010, Pages 12-18

  Hunt, Heather K ^a   Lew, Christopher M ^b   Sun, Minwei ^b   Yan, Yushan ^b   Davis, Mark E ^a  

^a California Institute of Technology   (United States)

^b University of California ^*  (United States)

Author keywords

Dielectric constant; Films; LTA; Ultra low k; Zeolite

Indexed keywords

CROSSTALK NOISE; DIELECTRIC CONSTANT; DIELECTRIC CONSTANTS; DIP COATING TECHNIQUES; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FRAMEWORK DENSITIES; LOW-K MATERIALS; LOW-RESISTIVITY SILICON SUBSTRATE; LTA; METAL-INSULATOR-METAL STRUCTURES; MINERALIZING AGENTS; POLYCRYSTALLINE; PRECURSOR FILMS; SILICA ZEOLITES; ULTRA LOW-K; ULTRA LOW-K MATERIALS; VAPOR PHASE TRANSPORT; X-RAY ENERGY DISPERSIVE ANALYSIS;

CAPACITANCE MEASUREMENT; ENERGY DISSIPATION; FIELD EMISSION; FIELD EMISSION MICROSCOPES; INTEGRATED CIRCUITS; METAL INSULATOR BOUNDARIES; PERMITTIVITY; SCANNING ELECTRON MICROSCOPY; SILICA; SILICATE MINERALS; STRUCTURAL METALS; SUBSTRATES; THERMOANALYSIS; THIN FILMS; TOPOLOGY; VAPORS; X RAY DIFFRACTION ANALYSIS; ZEOLITES;

DIELECTRIC MATERIALS;

EID: 71849094930     PISSN: 13871811     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.micromeso.2009.07.023     Document Type: Article

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