Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 43, Issue 1, 2007, Pages 41-46

  Zhu, Qingsheng ^a   Zhang, Li ^a   Wang, Zhongguang ^a   Wu, Shiding ^a   Shang, Jianku ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b University of Illinois at Urbana Champaign   (United States)

Author keywords

Equal channel angular pressing; Intermetallics; Mechanical property; Pb free solder; Sn3.8AgO.7Cu alloy

Indexed keywords

BRITTLE FRACTURE; COOLING; EQUAL CHANNEL ANGULAR PRESSING; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SOLIDIFICATION; STRESS-STRAIN CURVES; TENSILE PROPERTIES; TENSILE STRENGTH; TENSILE STRESS; TRANSMISSION ELECTRON MICROSCOPY;

INTERMETALLIC COMPOUND (IMC); LEAD FREE SOLDER; TENSILE ELONGATION;

SOLDERING ALLOYS;

EID: 34047133952     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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