Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

Journal of Materials Science: Materials in Electronics

Volumn 17, Issue 5, 2006, Pages 379-384

  Zhu, Fulong ^a   Zhang, Honghai ^a   Guan, Rongfeng ^a,c   Liu, Sheng ^a,b  

^a HUAZHONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

^b Wayne State University   (United States)

^c HENAN POLYTECHNIC UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

MICROSTRUCTURE; SOLDERING ALLOYS; STRAIN RATE; TENSILE STRENGTH; TENSILE TESTING; THERMAL EFFECTS;

LEAD-FREE SOLDER ALLOY; TEMPERATURE DEPENDENCE; TIN-COPPER ALLOY;

TIN ALLOYS;

EID: 33745084645     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-7474-3     Document Type: Article

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