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Volumn 80, Issue 11, 2009, Pages

Enhancement-mode double-top-gated metal-oxide-semiconductor nanostructures with tunable lateral geometry

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Indexed keywords


EID: 70350612883     PISSN: 10980121     EISSN: 1550235X     Source Type: Journal    
DOI: 10.1103/PhysRevB.80.115331     Document Type: Article
Times cited : (65)

References (52)
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    • edited by P. V. Dressendorfer and T. P. Ma (John Wiley and Sons, New York
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    • (1989) Ionizing Radiation Effects in MOS Devices and Circuits , pp. 401
    • Ma, T.P.1
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    • 70350601779 scopus 로고    scopus 로고
    • Significant positive shifts in Vfb and corresponding negative shifts in Qfb were also observed after both polysilicon etch and Al2 O3 deposition. Negative charge has been previously reported in ALD Al2 O3 films on oxide (Ref.) which is qualitatively consistent with this result. Also notable is that the Vfb shift is less positive for the thicker Al2 O3 films. The cause of this is unclear, however it seems reasonable that the e-beam damage is depth dependent so the negative charge introduced during the deposition would be located further from the interface for the thicker Al2 O3 film, leading to a smaller Vfb shift. Negative charging of the oxide after reactive ion etching has been reported previously and is also consistent with the results from this study (Ref.).
    • Significant positive shifts in Vfb and corresponding negative shifts in Qfb were also observed after both polysilicon etch and Al2 O3 deposition. Negative charge has been previously reported in ALD Al2 O3 films on oxide (Ref.) which is qualitatively consistent with this result. Also notable is that the Vfb shift is less positive for the thicker Al2 O3 films. The cause of this is unclear, however it seems reasonable that the e-beam damage is depth dependent so the negative charge introduced during the deposition would be located further from the interface for the thicker Al2 O3 film, leading to a smaller Vfb shift. Negative charging of the oxide after reactive ion etching has been reported previously and is also consistent with the results from this study (Ref.).
  • 43
    • 70350588352 scopus 로고    scopus 로고
    • A slight positive shift in Vfb is observed for e-beam deposition relative to thermal deposition, leading to a lower net positive charge for the e-beam Al case. Mobility is, however, reduced after e-beam deposition as compared to thermal Al deposition, indicating the presence of more scattering centers. The combination of the mobility measurements and the extracted Qfb suggests that more negative charge centers are introduced by the e-beam deposition than the thermal Al case leading to a lower net positive Qfb but to more total charge centers in the oxide near the interface. This is consistent with literature reports of damage produced by e beam but not thermal processes (Ref.).
    • A slight positive shift in Vfb is observed for e-beam deposition relative to thermal deposition, leading to a lower net positive charge for the e-beam Al case. Mobility is, however, reduced after e-beam deposition as compared to thermal Al deposition, indicating the presence of more scattering centers. The combination of the mobility measurements and the extracted Qfb suggests that more negative charge centers are introduced by the e-beam deposition than the thermal Al case leading to a lower net positive Qfb but to more total charge centers in the oxide near the interface. This is consistent with literature reports of damage produced by e beam but not thermal processes (Ref.).
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    • 10.1103/PhysRevB.44.9088
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  • 46
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    • Three crucial modifications were made. More RCA and HF cleans were introduced into the process, an Al-lift-off process was used for the final top gate, which protected the underlying Al2 O3 better and a hard mask was used for the polysilicon etch, which reduced the plasma processing exposure necessary to remove the photoresist. More details are found in Appendix.
    • Three crucial modifications were made. More RCA and HF cleans were introduced into the process, an Al-lift-off process was used for the final top gate, which protected the underlying Al2 O3 better and a hard mask was used for the polysilicon etch, which reduced the plasma processing exposure necessary to remove the photoresist. More details are found in Appendix.
  • 49
    • 0001412759 scopus 로고
    • 10.1103/PhysRevB.41.7929
    • J. A. Nixon and J. H. Davies, Phys. Rev. B 41, 7929 (1990). 10.1103/PhysRevB.41.7929
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.