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Volumn 47, Issue 1, 2009, Pages 71-78

Effective diffusivity of lead free solder alloys

Author keywords

Effective diffusivity; Lead free solder alloys; Monte Carlo; Multi scale modeling

Indexed keywords

AVERAGE GRAIN SIZE; DIFFUSIVITIES; EFFECTIVE DIFFUSIVITIES; EFFECTIVE DIFFUSIVITY; LEAD FREE SOLDER ALLOYS; LEAD-FREE SOLDER ALLOY; MICRO-STRUCTURAL; MONTE CARLO; MONTE CARLO SIMULATION; MULTI-SCALE MODELING; SOLDER ALLOYS; VACANCY DIFFUSIVITY;

EID: 70350572778     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2009.06.015     Document Type: Article
Times cited : (22)

References (45)
  • 2
    • 0030400290 scopus 로고    scopus 로고
    • An Analysis of Void Nucleation in Passivated Interconnect Lines Due to Vacancy Condensation and Interface Contamination
    • San Fransisco, CA
    • R.J. Gleixner, W.D. Nix, An Analysis of Void Nucleation in Passivated Interconnect Lines Due to Vacancy Condensation and Interface Contamination, in: Thin Films: Materials Reliability in Microelectronics VI, San Fransisco, CA, 1996, pp. 475-480.
    • (1996) Thin Films: Materials Reliability in Microelectronics VI , pp. 475-480
    • Gleixner, R.J.1    Nix, W.D.2
  • 7
    • 70350574406 scopus 로고    scopus 로고
    • H. Ye, Mechanical Behavior of Microelectronics and Power Electronics Solder Joints under High Current Density: Analytical Modeling and Experimental Investigation, in: Department of Civil, Structural, and Environmental Engineering, University at Buffalo, State University of New York: Buffalo, 2004, p. 297.
    • H. Ye, Mechanical Behavior of Microelectronics and Power Electronics Solder Joints under High Current Density: Analytical Modeling and Experimental Investigation, in: Department of Civil, Structural, and Environmental Engineering, University at Buffalo, State University of New York: Buffalo, 2004, p. 297.
  • 8
    • 46449101407 scopus 로고    scopus 로고
    • Department of Civil, Structural and Environmental Engineering, University at Buffalo, State University of New York: Buffalo, New York
    • M. Lin, A damage mechanics framework for electromigration failure, in: Department of Civil, Structural and Environmental Engineering, University at Buffalo, State University of New York: Buffalo, New York, 2006, p. 262.
    • (2006) A damage mechanics framework for electromigration failure , pp. 262
    • Lin, M.1
  • 13
    • 50249085223 scopus 로고    scopus 로고
    • Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps
    • San Jose, CA, USA
    • S. Gee et al., Mean Time To Failure in Wafer Level-CSP Packages with SnPb and SnAgCu Solder Bumps, in: International Wafer-Level Packaging Conference, San Jose, CA, USA, 2005.
    • (2005) International Wafer-Level Packaging Conference
    • Gee, S.1
  • 26
    • 70350574405 scopus 로고
    • The dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders
    • International
    • R.F. Pinizzotto et al. The dependence of the activation energies of intermetallic formation on the composition of composite Sn/Pb solders, in: Reliability Physics Symposium, 1993. 31st Annual Proceedings, International, 1993.
    • (1993) Reliability Physics Symposium, 1993. 31st Annual Proceedings
    • Pinizzotto, R.F.1
  • 29
    • 0142195939 scopus 로고    scopus 로고
    • H. Ye, C. Basaran, D.C. Hopkins, Numerical simulation of stress evolution during electromigration in IC interconnect lines. Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on] 26(3) (2003) 673-681.
    • H. Ye, C. Basaran, D.C. Hopkins, Numerical simulation of stress evolution during electromigration in IC interconnect lines. Components and Packaging Technologies, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part A: Packaging Technologies, IEEE Transactions on] 26(3) (2003) 673-681.


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.