Damage mechanics of electromigration in microelectronics copper interconnects

International Journal of Materials and Structural Integrity

Volumn 1, Issue 1-3, 2007, Pages 16-39

  Basaran, Cemal ^a   Lin, Minghui ^a  

^a UNIVERSITY AT BUFFALO   (United States)

Author keywords

copper interconnects; damage mechanics; electromigration; thin film

Indexed keywords

EID: 70350571503     PISSN: 17450055     EISSN: 17450063     Source Type: Journal    
DOI: 10.1504/ijmsi.2007.013864     Document Type: Article

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